TSMC (Taiwan Semiconductor Manufacturing Company) has announced its 6nm process. The move from the current 7nm to the new 6nm process brings a lot of improvements and significant¬†enhancements as more components are being placed on the chip. That’s 18% higher density over the previous process, as explained by the company.

TSMC also talks about great performance-to-cost advantage and “fast time-to-market with direct migration from N7-based designs”, according to a DigiTimes report. Risk production on the N6 technology is scheduled to begin in the first quarter of 2020. TSMC is already running another risk production on the 7nm process ¬†using extreme ultraviolet (EUV) lithography.

As far as applications for the new 6nm process are concerned, these are varied, and include high-end smartphones mobile, AI, 5G infrastructure, GPU, and others.

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