The Snapdragon 810 powers some of the highest-end phones on the market right now. And while it’s the silicon behind devices like the HTC One M9, Qualcomm finds its SoC behind fewer top-tier devices than it might have just one year ago. Samsung, for instance, side-stepped Qualcomm altogether with the Exynos chips in the Galaxy S6, and the new LG G4 goes with the slightly (and we mean ever-so slightly) lower-end 808. Choices like those have helped fuel rumors of problems with the 810, and specifically claims of overheating. While in the months since that kind of talk ran rampant we’ve come to accept that those claims were largely overblown, Qualcomm hasn’t forgotten, and in a recent interview Qualcomm’s VP of marketing Tim McDonough speaks out about the incident.
McDonough is resolute in his assertion that the rumors of 810 overheating are “rubbish,” stating that, “there was not an overheating problem with the Snapdragon 810 in commercial devices.”
He concedes that earlier development hardware ran hot, but that somewhere along the way, rumors about pre-release 810 components morphed into this tale that the final commercial chip was similarly compromised.
There’s an air of slight paranoia to McDonough’s account, as he suggests that “someone very artfully took [reports of hot-running 810 dev hardware] and used it to fuel the rumors.”
McDonough has hope that the forthcoming Snapdragon 820 will help restore manufacturer confidence in his company’s SoCs, maybe even bringing Samsung back into the ring.