Word is that Qualcomm has turned to Samsung’s foundries for another round of top-grade application processors.
As far as we know, sources at Samsung’s Large-Scale Integration division have told The Electronic Times of Korea that it has received orders for the Snapdragon 830, a chipset to be built on a 10nm die. The volume appears to be about equivalent as when Qualcomm contracted Samsung for the Snapdragon 820 last year.
“A senior official” said that Qualcomm is bouncing back from its horrible year with the Snap 810, a chipset that seemed to overheat unlike its predecessors and one that was avoided by Samsung for use in its 2015 flagship devices. Samsung was able to deliver on a 14nm architecture for the Snpadragon 820, a chip found in about half of all Galaxy S7 devices. The Snapdragon 830 will apparently be on half of all Galaxy S8 devices as well with Samsung’s own Exynos chipsets taking the other half.
Qualcomm will also collaborate with Samsung on innovating beyond the need for printed circuit boards to use as substrates for the chips and instead work on Fan-out Panel Level Packages, a workbench that will end up costing less to semiconductor makers.
The San Diego-based silicon giant continues seeing a slope down in top-end chips, thanks to consumer trends pushing smartphone manufacturers into mid-range pricing territory.