Qualcomm negates Snapdragon 820 overheating speculation
It’s no secret the widespread and hard to contain cooling issues of the Snapdragon 810 SoC rocked Qualcomm’s dependability to its core, but thanks to a toweringly dominant market position, the semiconductor giant managed to survive the scandal.
Rumor has it Samsung is even willing to embrace the company’s next-gen smartphone flagship chip, the Snapdragon 820, which should power the Galaxy S7 in regions the Exynos 8890, aka M1, may not penetrate.
But Qualcomm can’t afford new controversy, regardless of the Korean device manufacturer’s readiness to customize and stabilize a prospectively overheating SD820. After all, the ambitions of the Exynos lineup are growing as we speak, and MediaTek is no longer to be viewed a key player just in the low-cost segment.
It comes as no surprise therefore the San Diego-based processor champion wants the world to know Snapdragon 820 development is going as planned, with “terminal cooling requirements and performance specifications” all satisfied at the moment.
Translation – the chip runs as cool as a cucumber in internal testing, and the use of a 14nm fabrication process should allow it to achieve the “improvement and enhancement” guidelines advertised as of late. Namely, Qualcomm expects the four new 2.2 GHz custom Kryo CPU cores to double the power efficiency and speed of SD810’s eight 2.0 + 1.5 GHz nuclei, while the accompanying Adreno 530 GPU is said to offer up to 40 percent better graphics performance than the 430, as well as significantly reduced energy consumption.
Other big upgrades concern LTE connections, security and Quick Charge 3.0, the latest standard in blazing fast phone charging. Let’s hope everything will look in real life as sweet as it does in paper, and Snapdragon 820 handhelds won’t have to randomly shut down on account of overheating.