There are lots of rumors and reports on the upcoming iPhone(s) and parts are leaking left and right. Whether they’re the real deal or not is yet unknown, but today, we’re seeing some more purported internals of the soon-to-land Apple flagship phone.

Whether it will be the iPhone 5S or iPhone 6, these images, above and below, claim to depict the motherboard inside the next iPhone. Although similar to the motherboard of the iPhone 5, there are a couple of differences though. Whether there will be some new features inside the phone or not is yet unknown. Reports claim that the Apple phone will pack a faster A6 processor with, as usual, improved graphics, 2GB of RAM, and a larger, 12-megapixel camera with dual-LED flash. Fingerprint scanning is also rumored, alongside NFC and and possible an updated LTE radio. There are all rumors though.

Next Apple iPhone motherboard leaks

Source: NowhereelseWeibo
Via: BGR

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