Next year’s Moto X leaks again, reveals internal heat pipe for cooling
Everybody wants to have the hot new smartphone, sure, but maybe not so much a hot-hot phone. We demand a hell of a lot of performance from our mobile devices, and for as much chip-makers can do to try and ensure that their products run as cool as possible, a phone that gets warm to the touch, if not outright hot, is often a fact of life. Certain manufacturers go to some lengths to see that their phones manage such thermal issues as gracefully as possible, using heat spreaders and thermal pipes to draw heat away from the hottest components and allow it to dissipate. That’s just what Motorola may be looking to do with next year’s flagship, as revealed in the latest leaked photos of the next-gen Moto X.
Just like recent models like the Sony Xperia Z5 and Microsoft Lumia 950 XL, this internal shot of a supposed 2016 Moto X shows the phone getting a heat pipe.
It’s been suggested that the phone could run Qualcomm’s Snapdragon 820, but don’t let the heat pipe here scare you; so far, we’ve no reason to expect the 820 will experience excessive problems with heat, and this effort could simply be to help the Moto X come in just a little bit lower on the “warm” bit of the spectrum – making it feel more premium in the process.
While we don’t see much else of note in here, the hardware certainly appears to be a good match for last week’s initial Moto X leak, sharing the same case shape and featuring that unusually prominent rear grille that sure seems like it could be for the phone’s speaker.