After being China’s darling debutante in mobile last year, we already see the LeTV hardware brand making headway around Asia. It’s now kicking down the doors of the United States with a new league of smartphone and a new chipset from Qualcomm.

Let’s be clear: the LeTV Max Pro, while being ostentatious in its promotions, its name and its presence (a 6.3-inch quad HD screen will do for “big”), will be somewhat different coming to the United States than the Chinese model we had our hands on today.

That said, many of the internals like the Snapdragon 820, 4GB of RAM, a rear camera packing in 21 megapixels of resolution and internal flash storage options up to 128GB. We would bet on the US trim also receiving that ultrasonic fingerprint sensor — powered by Qualcomm’s Sense ID tech — and some skinned Android Marshmallow — to what extent, we don’t exactly know.

What we do know lies in our hands-on video below. Check it out!



Pocketnow’s CES 2016 coverage is made possible by dbrand, the boss of vinyl skins for smartphones, tablets, wearables and more. For the most precise fit on earth, visit http://dbrand.com.

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