For the first time in years, it seems that all OEMs have all agreed on using the Snapdragonn 820 as the main course meal for processing power. We’ve seen just how reliable and power efficient it can be, but we all know the world of mobile technology doesn’t stop there. We know the next iteration is the Snapdragon 823, and LeEco has already planned something.

The company today has posted a teaser for ann event to happen in Shanghai on June 29. The company doesn’t really provide specifics, but given its speed analogy using a bulet being fired, the rumors of a flagship coming in June, and the rumors of LeEco pioneering the Snapdragon 823, and all things fall into place. The rest of the rumored specs hint to 8GB of RAM and a 25 megapixel primary camera.

We’ll keep a look out to see what happens in the end.


Source: LeEco
Via: GSMArena

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