By Stephen Schenck | June 13, 2011 8:05 PM
How do you make a thinner smartphone? Obviously, you want all your components as small as possible, and then you have to look at how to arrange them to best make use of space. Less clear is what space is wasted just attaching parts together. Every flap, tab, and other connection point takes up space. HTC is reportedly considering the adoption of a new manufacturing technique that could allow it to build sturdy smartphones while cutting down on some of that waste.
Chenming Mold Industrial has a process called Nano Molding Technology which attaches plastic directly to metal without additional adhesive. First the metal is etched to provide a surface for the plastic to grab on to, then the liquid plastic is deposited onto the exposed metal. When it hardens, we’re left with a strong bond between the materials without the need for any interconnecting mechanics.
When applied to smartphones, NMT may only shave off a fraction of a millimeter here and there, but each of those junctions can add up to a noticeably slimmer build. Neither HTC nor CMI have confirmed that HTC will be using the technology in its future phones, but CMI says NMT is ready for mass use on smartphones as of this July.