By GabePeters | January 17, 2012 12:03 AM
Thanks to some ROMs posted in the last few days, we have a smattering of specifications and other information available for several upcoming HTC devices, among them HTC Holiday and HTC Lead. After close examination, we have determined that both devices feature LTE/HSPA+ support, allowing the highest data transfer speed possible on AT&T. As the first HSPA+/LTE devices seen on AT&T, these are likely to be featured in the initial LTE launch, with rumors that HTC Puccini may also feature LTE.
For a quick comparison of features, both devices feature 1.2GHz dual-core processors, with the lead having 768MB RAM vs. 1GB on the Holiday. Both are large devices, with a 4.3-inch WVGA screen on the Lead, and the Holiday featuring a 4.5-inch qHD display. Lead features no front camera and a 5-megapixel rear camera, while Holiday features a 1.3-megapixel front camera and an 8-megapixel rear camera. Both devices feature Bluetooth support, but interestingly the chipset used in the HTC Lead is a Broadcom BCM4329, which features Bluetooth 3.0. The chipset used in HTC Holiday is a newer model BCM4330 which features Bluetooth 4.0 support, boasting “low energy technology” which provides up to a 90% reduction in power usage.
Both devices run on the Qualcomm MSM8660 baseband chipset, providing HSPA+ support up to 21.1Mbps downstream and 5.76Mbps upstream, and feature LTE support. Qualcomm’s latest GPU, the Adreno 220 is provided for 3D acceleration, with both smartphones being very capable powerhouses. We’ll keep our eyes open for further information as it becomes available.