Rumors continue to point to Apple releasing its iWatch by the end of this year. We’ve also heard that the company has struggled to find manufacturing processes that are possible to comply with by its partners. Today we learn that there is progress in the future of this device for this year, but that also includes some new tricks up its sleeve.
According to The China Times, Apple and its partners have begun manufacturing the different variations of the iWatch for a fall 2014 launch, and though a specific month wasn’t provided, things sound most possible around the third quarter. An interesting twist to these rumors though, is that Apple is reportedly using a new chip layout for miniaturization purposes. According to the report:
“According to supply chain sources cited by the Chinese media, Apple has already started producing the iWatch in small quantities. The smartwatch will allegedly be ready for launch in the second half of 2014, but more importantly, these fresh reports also claim that the iWatch will be built using SiPs (or system-in-package modules) as opposed to traditional PCBs (Printed Circuit Boards)”
Which follows a report from 9to5Mac from January that also mentioned:
Sources also hint that Apple has developed technologies to be able to pack several different sensors into a single chipset for miniaturization purposes.
With competition like the Moto 360 coming in the future, Apple clearly needs to innovate in the design of the iWatch. At the moment there aren’t any leaks on its design, but as manufacturing begins, it’s only a matter of time before we see it for the first time.