By Stephen Schenck | December 10, 2013 5:53 PM
Is Huawei really abandoning the US market? That’s a big, fat “maybe” for the moment, as we wait to see just how serious some comments made by company execs really are. But even if America doesn’t see a new Huawei handset anytime soon, the manufacturer continues to have big international ambitions, and today we get to hear a little about how one of its next major models could arrive.
This past summer, Huawei launched the Ascend P6 (above), with a 4.7-inch 720p display, 2GB of RAM, and 1.5GHz HiSilicon quad-core K3V2 SoC. One of the big selling points was its slim build, measuring a sleek 6.18 millimeters thick. Now we’re looking at the Ascend P7, which gets its specs revealed thanks to a new leak.
This time, screen size grows to five inches, while making the resolution jump to 1080p. RAM should stay at 2GB, while we’d see 16GB internal storage augmented by the option for microSD expansion. The phone could also get a 13-megapixel main camera with a very high-res eight-megapixel front-facer.
As for the chipset, we’re a little confused. This leak spells it out as a HiSilicon Balong 910, but unless the company changed how it does things, the Balong is for the radio, and there’s a separate application processor. In any case, it should be a quad-core 1.6GHz component.
While the source behind this reports that the phone should resemble the P6, there’s no mention here as to just how thin the P7 might be. If any of this information is accurate, Huawei may be planning to release the phone in April of next year.
Source: GSM Arena