ASUS MWC Teaser Hints at Metal Device, Likely Its “Fonepad”
Yesterday’s launch of the HTC One has devices which eschew plastic for a metal construction on our minds, and today our thoughts return to the topic, upon ASUS releasing an MWC 2013 teaser video for its “metallic miracle.”
Between that line, and the video’s description referencing “when Pad and Phone come together,” it’s sounding pretty likely that the company is talking about the model ME371MG we looked at a little earlier this month, supposedly being developed under the name Fonepad.
Besides the aluminum body we got to see in a leaked pic, that device is interesting for its use of an Intel chip, rather than the ARM-based components that so dominate the mobile landscape. While the specs we’ve seen associated with the Fonepad weren’t exactly stellar, like a three-megapixel main camera and just one gigabyte of RAM, the metallic build could win the tablet some fans, especially if you’re looking for an iPad-like look from an Android model. Unfortunately, the price we’ve heard for the Fonepad, starting around $350, may be a little steep for what it actually offers, at least compared to the company’s Nexus 7, but we’re willing to withhold judgment until we get the full story next week.